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Reballing BGA153

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Am postat si la sectiunea servicii in speranta unui ajutor; poate ca subiectul e mai potrivit aici la depanare telefoane! 

Deci : am de lipit un cip EMMC BGA153 pe un PCB! Trebuie rebilat mai intai! am si pasta de lipit SMD, nu stiu daca este potrivita pentru bile ,eu o folosesc curent la lipit cu aer cald! Pot comanda si bile 0.3 mm daca este nevoie,sita nu am, si chiar daca as avea ,nu am indeminarea necesara!


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